Title:
ヒートポンプ装置
Document Type and Number:
Japanese Patent JP6544563
Kind Code:
B2
Abstract:
A heat pump apparatus includes an evaporator evaporating a refrigerant, an electrochemical compressor compressing the refrigerant evaporated in the evaporator, and a condenser condensing the refrigerant compressed by the electrochemical compressor. The heat pump apparatus is structured such that the refrigerant in a wet steam state is supplied from the evaporator to the electrochemical compressor.
Inventors:
Baraki
Hiroyuki Sai
Hiroyuki Sai
Application Number:
JP2015080237A
Publication Date:
July 17, 2019
Filing Date:
April 09, 2015
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
F25B21/00; F25B27/00; F25B41/10
Domestic Patent References:
| JP2003262423A | ||||
| JP2008128629A | ||||
| JP2006145140A | ||||
| JP2008525747A | ||||
| JP9196504A |
Foreign References:
| US20020066277 | ||||
| WO2010126984A2 |
Attorney, Agent or Firm:
Koichi Kamata
Masatoshi Furuta
Masatoshi Furuta