Title:
ヒートポンプ装置
Document Type and Number:
Japanese Patent JP7099201
Kind Code:
B2
Abstract:
To provide a heat pump device that can shorten a start-up time even if it is a heat pump device for a two-stage compression two-stage expansion cycle.SOLUTION: A heat pump device comprises a bypass pipe L3 capable of introducing a refrigerant to a gas-liquid separator 14 from a steam pipe L10 connecting a refrigerant outlet P54 of an evaporator 15 and a suction port P4 of a low-stage compressor 11, and a control unit C for forming a closed circuit capable of circulating the refrigerant through at least the evaporator 15, the bypass pipe L3, the gas-liquid separator 14, and a low-stage expansion pipe L1 while the device is stopped. The refrigerant outlet P54 of the evaporator 15 is arranged vertically below a liquid-phase refrigerant outlet P1 of the gas-liquid separator 14. Thereby, the refrigerant in the closed circuit is preheated by discharged warm water H while the device is stopped.SELECTED DRAWING: Figure 1
Inventors:
Kensetsu Yasushima
Yoshida space-time
Yusuke Onishi
Shuhei Shibata
Masamichi Iwasaki
Atsushi Nakamura
Yoshida space-time
Yusuke Onishi
Shuhei Shibata
Masamichi Iwasaki
Atsushi Nakamura
Application Number:
JP2018165717A
Publication Date:
July 12, 2022
Filing Date:
September 05, 2018
Export Citation:
Assignee:
Fuji Electric Co., Ltd.
International Classes:
F25B1/00; F25B1/10; F25B27/02; F25B30/02
Domestic Patent References:
| JP201828395A | ||||
| JP201297963A | ||||
| JP201525579A | ||||
| JP2012504220A | ||||
| JP2006112784A | ||||
| JP2010112698A |
Foreign References:
| WO2013160929A1 |
Attorney, Agent or Firm:
Sakai International Patent Office
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