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Title:
ヒートポンプ蓄熱装置
Document Type and Number:
Japanese Patent JP4997782
Kind Code:
B2
Abstract:

To provide a compact and thin device by reducing a depth dimension of the device and reducing a wasted space in a constitution storing a heat pump circuit and a heat storage tank in one housing.

This heat pump heat storage device comprises a heat pump circuit 5 having a compressor 1, a radiator 2, a throttle means 3 and an evaporator 4, a heat storage portion 6 connected with the radiator 2 and having at least an approximate angular portion, and the housing 7 having an approximate angular portion having the approximate similar shape as the approximate angular portion of the heat storage portion 6, and the heat pump circuit 5 and the heat storage portion 6 are disposed in the housing 7 in a state that the approximate angular portion of the heat storage portion 6 and the approximate angular portion of the housing 7 are opposite to each other. As the approximate angular portion of the heat storage portion 6 and the approximate angular portion of the housing 7 are opposite to each other, the wasted space inside of the device is reduced, the heat storage portion is thinned, and the compact and thin device can be provided.

COPYRIGHT: (C)2007,JPO&INPIT


Inventors:
Sawada Kei
Masato Eyepiece
Application Number:
JP2006037448A
Publication Date:
August 08, 2012
Filing Date:
February 15, 2006
Export Citation:
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Assignee:
Panasonic Corporation
International Classes:
F24H7/02; F24D11/02; F24H1/00; F25B13/00; F28D20/02
Domestic Patent References:
JP2003279133A
JP2003314892A
JP2004085183A
JP2005226965A
JP2005337597A
JP60018455U
JP63012077U
JP61018386U
Attorney, Agent or Firm:
Hiroki Naito
Daisuke Nagano
Kentaro Fujii