Title:
ヒートポンプ構造
Document Type and Number:
Japanese Patent JP6406208
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To contribute to the reduction of the weight and size of a constitution as a whole.SOLUTION: In a heat pump structure 1, a high-temperature heat medium and a low-temperature/cold-temperature heat medium are exchanged for adsorption-type heat pumps 2, 3 by using four-way valves 21 to 24. The adsorption-side four-way valves 21, 22 are arranged between adsorption parts 11, 12 while being aligned in a first opposing direction X being a direction in which the heat pumps 2, 3 are aligned, and also in a third opposing direction which is orthogonal to a second opposing direction Y being a direction in which the adsorption parts 11, 12 and evaporation condensation parts 13, 14 are aligned. Similarly, the evaporation-side four-way valves 23, 24 are arranged between the evaporation condensation parts 13, 14 while being aligned in the third opposing direction. The four-way valves 21 to 24 have connecting parts 71 to 74 at both sides of the first opposing direction X and at both sides of the second opposing direction Y. Then, the connecting parts 71, 72 at both the sides of the first opposing direction X in the four-way valves 21 to 24 oppose outlet parts or inlet parts of heat medium passages in the adsorption parts 11, 12 and the evaporation condensation parts 13, 14.SELECTED DRAWING: Figure 1
Inventors:
Masakatsu Tsubouchi
Application Number:
JP2015208330A
Publication Date:
October 17, 2018
Filing Date:
October 22, 2015
Export Citation:
Assignee:
TOYOTA JIDOSHA KABUSHIKI KAISHA
International Classes:
F25B17/08; F25B41/04
Domestic Patent References:
| JP2004233030A | ||||
| JP2002243051A |
Foreign References:
| WO2009000029A1 |
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Hiroshi Fukuda
Kato Kazunori
Hiroshi Fukuda