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Title:
HEAT PUMP SYSTEM
Document Type and Number:
Japanese Patent JP2013113534
Kind Code:
A
Abstract:

To provide a heat pump system having a control configuration of each compressor to execute an operation of higher COP in comparison with a conventional one, though it is simple.

This heat pump system 100 includes a first temperature sensor T1 for measuring a temperature of water, a second temperature sensor T2 for measuring an outside air temperature, and a third temperature sensor T3 for measuring an evaporation temperature of a high stage-side refrigerant in a cascade condenser 2. A compressor control section 5 controls a high stage-side compressor 31 to reduce the deviation between the water temperature measured by the first temperature sensor T1 and a target hot water supply temperature, and controls a low stage-side compressor 11 to reduce the deviation between the evaporation temperature of the high stage-side refrigerant measured by the third temperature sensor T3, and a target evaporation temperature determined on the basis of the water temperature and the outside air temperature measured by the second temperature sensor T2.


Inventors:
AKIZUKI TAKAHIRO
Application Number:
JP2011261868A
Publication Date:
June 10, 2013
Filing Date:
November 30, 2011
Export Citation:
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Assignee:
SAMSUNG YOKOHAMA RES INST CO
International Classes:
F25B7/00
Attorney, Agent or Firm:
Ryuhei Nishimura
Akiko Sato
Saito Shindai