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Title:
HEAT PUMP SYSTEM
Document Type and Number:
Japanese Patent JP2019100688
Kind Code:
A
Abstract:
To provide a heat pump system capable of effectively using waste heat of a compressor by using a simple configuration while suppressing effects caused by operation control of a heat pump cycle.SOLUTION: A heat pump system 1 comprises a heat pump cycle 10, a high temperature side heating medium circuit 20, a low temperature side heating medium circuit 30 and an indoor air conditioning unit 50. The heat pump cycle 10 includes: a compressor 11 for compressing and discharging a refrigerant; a water-refrigerant heat exchanger 12 for radiating heat of the high-pressure refrigerant compressed by the compressor 11; a heat absorbing expansion valve 15b for decompressing the high-pressure refrigerant caused to flow out from the water-refrigerant heat exchanger 12; and a chiller 18 for evaporating the refrigerant decompressed by the heat absorbing expansion valve 15b for heat absorption. The high temperature side heating medium circuit 20 serving as a high temperature side heat receiving section includes a high temperature side recovery section 25 for recovering waste heat of the compressor 11 and radiates heat of the waste heat of the compressor 11 recovered by the high temperature side recovery section 25 to the high-pressure refrigerant side.SELECTED DRAWING: Figure 1

Inventors:
KONAKADE YUKI
KATO YOSHITAKE
FUSE TAKUYA
Application Number:
JP2017235997A
Publication Date:
June 24, 2019
Filing Date:
December 08, 2017
Export Citation:
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Assignee:
DENSO CORP
International Classes:
F25B47/02; B60H1/22; F24F12/00; F25B1/00; F25B5/02; F25B27/02; F25B39/02; F25B39/04
Domestic Patent References:
JP2006321389A2006-11-30
JP2005308344A2005-11-04
JPH02183780A1990-07-18
JP2014148295A2014-08-21
Foreign References:
CN206247684U2017-06-13
CN2926916Y2007-07-25
WO2014136450A12014-09-12
Attorney, Agent or Firm:
Patent Business Corporation Kaisei Patent Office