Title:
ヒートポンプシステム
Document Type and Number:
Japanese Patent JP5200996
Kind Code:
B2
Abstract:
A heat pump system (1) includes a heat source unit (2), a discharge refrigerant communication tube (12), a liquid refrigerant communication tube (13), a gas refrigerant communication tube (14), a first usage unit (4a), and a second usage unit (10a), wherein the first usage unit (4a) has a first usage-side heat exchanger (41a) capable of functioning as a radiator of the heat-source-side refrigerant introduced from the discharge refrigerant communication tube (12), the first usage unit is capable of performing operation in which an aqueous medium is heated by radiation of the heat-source-side refrigerant in the first usage-side heat exchanger (41a), the second usage unit (10a) has a second usage-side heart exchanger (101a) capable of functioning as an evaporator of the heat-source-side refrigerant introduced from the liquid refrigerant communication tube (13) and the second usage unit is capable of performing operation in which an air medium is cooled by evaporation of the heat-source-side refrigerant in the second usage-side heat exchanger (101a).
Inventors:
Masahiro Honda
Application Number:
JP2009041319A
Publication Date:
June 05, 2013
Filing Date:
February 24, 2009
Export Citation:
Assignee:
Daikin Industries, Ltd.
International Classes:
F25B29/00; F24D3/18; F25B1/00; F25B5/02; F25B6/02; F25B7/00; F25B13/00; F25B30/02; F25B47/02
Domestic Patent References:
JP10141796A | ||||
JP60164157A | ||||
JP60048468A | ||||
JP2169968A | ||||
JP2007232225A | ||||
JP7225064A | ||||
JP1210771A | ||||
JP2004132647A |
Attorney, Agent or Firm:
Shinki Global IP Patent Corporation