To improve the heat-radiating ability of a heat radiating structure by forming a heat radiating fin section, having a plurality of heat radiating fins and connecting a contact type heat conducting section to the fin section, and then, tightly adhering a heat pipe to the heat conducting section with a sufficiently large contact area and efficiently transferring the heat of electronic circuit parts and the atmospheric heat in a unit to the fin section.

A heat-radiating fin section 10, having a plurality of heat radiating fins, is provided on the outside of a unit 2, and a contact-type heat conducting section having elasticity and heat conductivity is provided to the fin section 10. The heat-conducting section is tightly adhered to the fin section 10 and, at the same time, the section is set so that the section can be adhered tightly to the front end section a heat pipe 5, when a printed board 1 is inserted.