Title:
HEAT RADIATION COMPONENT AND MANUFACTURING METHOD THEREOF, AND POWER MODULE
Document Type and Number:
Japanese Patent JP2009038162
Kind Code:
A
Abstract:
To provide a heat radiation component having a reliable junction section between a heat sink and a metal layer formed on the heat sink and made of Cu or a Cu alloy, to provide a method of manufacturing the heat radiation component, and to provide a power module.
The heat radiation component has a buffer layer 22 made of Ni or an Ni alloy and the metal layer 23 made of Cu or Cu alloy and formed by flame spraying on the heat sink 21 made of Al or an Al alloy. The buffer layer 22 is interposed, thus suppressing the generation of an intermetallic compound by reaction of a metal material composing the heat sink 21 to that composing the metal layer 23.
Inventors:
FUTAI KAZUHIKO
Application Number:
JP2007200272A
Publication Date:
February 19, 2009
Filing Date:
August 01, 2007
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H01L23/373; H01L23/36; H05K7/20
Attorney, Agent or Firm:
Minoru Nakano
Mikio Yamaguchi
Hideaki Nishima
Mikio Yamaguchi
Hideaki Nishima