Title:
HEAT RADIATION PLATE, AND SUBMARINE APPARATUS
Document Type and Number:
Japanese Patent JP2015018971
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To easily and precisely visualize that heat conductive resin is horizontally filled without air bubbles.SOLUTION: A heat transfer structure plate 3 radiates heat of a heating component mounted on a circuit board. The heat transfer structure plate 3 has a pool 31 for heat conductive resin, and a height check part 3a. Heat conductive resin 4 for transferring the heat of an electronic component is filled in the pool 31 for heat conductive resin. The height check part 3a is formed on the pool 31 for heat conductive resin so that a liquid surface level of the heat conductive resin 4 can be visualized, and has a staircases upper face part 3a-1 and a staircases lower face part 3a-2 in a staircases manner at a position lower than a pool outer edge 31a and higher than a pool bottom face 31b. When the pool 31 for heat conductive resin is normally filled with the heat conductive resin 4, the staircases lower face part 3a-2 of the height check part 3a is covered with the heat conductive resin 4, and the staircases upper face part 3a-1 is not covered with the heat conductive resin 4 and is exposed.
Inventors:
YOSHIZUMI TAKAHISA
HOSHIYAMA NAOTO
HOSHIYAMA NAOTO
Application Number:
JP2013145831A
Publication Date:
January 29, 2015
Filing Date:
July 11, 2013
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H05K7/20; H02G15/12; H05K1/02; H05K3/28
Domestic Patent References:
| JP2005142292A | 2005-06-02 | |||
| JP2003244959A | 2003-08-29 | |||
| JP2002134931A | 2002-05-10 | |||
| JP2012248700A | 2012-12-13 | |||
| JP2012227532A | 2012-11-15 | |||
| JP2004363183A | 2004-12-24 | |||
| JP2009141213A | 2009-06-25 | |||
| JP2004222426A | 2004-08-05 | |||
| JP2014241366A | 2014-12-25 |
Foreign References:
| WO2008000551A2 | 2008-01-03 | |||
| US20080291639A1 | 2008-11-27 | |||
| US20090059498A1 | 2009-03-05 |
Attorney, Agent or Firm:
Hiroaki Sakai
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