Title:
HEAT-RELEASING ADHESIVE SHEETS
Document Type and Number:
Japanese Patent JP2000230158
Kind Code:
A
Abstract:
To prepare a heat-releasing adhesive sheet which is useful as a sheet for fixing or winding and stopping electronic parts or the like, has an excellent heat-releasing property, does not contaminate the surfaces of the members or the inner portions of the parts, and has an excellent balance between mechanical strengths and adhesive characteristics.
This heat-releasing adhesive sheet is obtained by disposing a pressure-sensitive adhesive layer on at least one surface of a porous substrate. Therein, the porous substrate has a porosity of 40-90% and a three-dimensional porous penetrated structure. The porous substrate has an air permeability of ≤400 sec/100 cc, and contains a polyolefin having an ultrahigh weight-average mol.wt. of ≥1×106.
Inventors:
YAMAMOTO KAZUNARI
ICHIKAWA TOMOAKI
NOMI TOSHISUKE
YAMAGUCHI MUTSUKO
ICHIKAWA TOMOAKI
NOMI TOSHISUKE
YAMAGUCHI MUTSUKO
Application Number:
JP3193999A
Publication Date:
August 22, 2000
Filing Date:
February 09, 1999
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
H01L23/373; C09J7/02; C09J121/00; C09J133/00; C09J201/00; (IPC1-7): C09J7/02; H01L23/373
Attorney, Agent or Firm:
Yoshinori Hosoda
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