Title:
HEAT-RESISTANT ADHESIVE COMPOSITION AND SUBSTRATE FOR FLEXIBLE PRINTED WIRING
Document Type and Number:
Japanese Patent JP3522985
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a heat-resistant adhesive composition good in various characteristics.
SOLUTION: This heat-resistant adhesive composition has a composition comprising (1) 100 pts.wt. epoxy resin, (2) 30-100 pts.wt. nitrile rubber, (3) 1-30 pts.wt. curing agent and (4) 0.1-5 pts.wt. one or more curing accelerators selected from imidazole compounds, tetraboroates of tertiary amines, borofluorides and octylates. The nitrile rubber is composed of (A) a nitrile rubber containing carboxyl groups at the terminals and (B) a nitrile rubber having 25-45wt.% acrylonitrile content and no functional group at the terminals at (95/5) to (55/45) blending weight ratio of the components (A)/(B).
Inventors:
Yuyama, Masahiro
Arai, Hitoshi
Eikuchi, Kichiji
Arai, Hitoshi
Eikuchi, Kichiji
Application Number:
JP22674396A
Publication Date:
April 26, 2004
Filing Date:
August 28, 1996
Export Citation:
Assignee:
SHIN ETSU CHEM CO LTD
International Classes:
C08G59/40; C08G59/68; C08L63/00; C09J163/00; H05K3/38; (IPC1-7): C09J163/00; C08G59/40; C08G59/68; H05K3/38
Attorney, Agent or Firm:
荒井 鐘司