Title:
HEAT-RESISTANT ADHESIVE COMPOSITION FOR TEMPORARILY FIXING WAFER, AND FILM
Document Type and Number:
Japanese Patent JP2010254808
Kind Code:
A
Abstract:
To provide a heat-resistant adhesive composition for temporarily fixing a wafer which is suitable for the application in which a silicon wafer is temporarily fixed to a holding material, has achieved excellent adhesiveness between the holding material and the wafer, and is excellent in heat resistance.
The heat-resistant adhesive composition for temporarily fixing a wafer includes a polymer having a repeating unit represented by general formula (I) or (II), wherein Y is an aromatic diamide or an aromatic amide imide, and Y may be different for each repeating unit.
Inventors:
KAWAI AKIYASU
TOMOTA NAOKO
TOMORI NAOMI
TOMOTA NAOKO
TOMORI NAOMI
Application Number:
JP2009106563A
Publication Date:
November 11, 2010
Filing Date:
April 24, 2009
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09J177/10; C08G69/40; C08G73/10; C09J7/02; C09J179/08; H01L21/304
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu