HEAT-RESISTANT ADHESIVE, FILM WITH HEAT-RESISTANT ADHESIVE LAYER AND PRODUCTION OF THERMOPLASTIC RESIN

Title:

HEAT-RESISTANT ADHESIVE, FILM WITH HEAT-RESISTANT ADHESIVE LAYER AND PRODUCTION OF THERMOPLASTIC RESIN

Document Type and Number:

Japanese Patent JP3779334

Kind Code:

B2

Abstract:

PURPOSE: To improve heat resistance and adhesive force by incorporating a thermoplastic resin obtained by reacting a given thermo-plastic resin and a coupling agent.
CONSTITUTION: An aromatic diamine and/or bisphenol is polycondensed with a di-, tri- or tetra-carboxylic acid or an aromatic chloride to obtain a thermoplastic resin of formula I [wherein R1 to R4 are each H, a lower alkyl, lower alkoxy or halogen; X is bond, -O-, -S-, -C(=)-, -SO2-, -S(=O)-, formula II to IV (where R5 and R6 are each H, a lower alkyl, trifluoromethyl, trichloromethyl or phenyl); Y is formula V or VI (where Ar is a divalent aromatic group; and Ar' is a trivalent group)] which is obtained in reactions for forming amide, ester, imide or ether groups. The resin in an amount of 80-99.9 pts.wt. is reacted with 20-0.1 pts.wt. of a coupling agent having functional group(s) capable of bonding chemically with the resin to obtain another thermoplastic resin, which is incorporated in the objective adhesive.

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Inventors:

Yoshihiro Nomura
Hiroshi Kirihara
Tsuyoshi Uchida

Application Number:

JP21004293A

Publication Date:

May 24, 2006

Filing Date:

August 25, 1993

Export Citation:

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Assignee:

Hitachi Chemical Co., Ltd.

International Classes:

C08G73/10; C09J7/02; C08L79/08; C09J151/00; C09J151/08; C09J167/00; C09J171/00; C09J171/10; C09J177/00; C09J179/08; C09J201/00; H01L21/60; H01L23/50; H05K1/03; (IPC1-7): C09J201/00; C08G73/10; C08L79/08; C09J7/02; C09J7/02; C09J7/02; C09J151/08; C09J167/00; C09J171/10; C09J177/00; C09J179/08

Domestic Patent References:

JP48047929A
JP62062874A
JP1268778A
JP62148566A
JP4248890A

Attorney, Agent or Firm:

Hidekazu Miyoshi

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