Title:
HEAT-RESISTANT ADHESIVE
Document Type and Number:
Japanese Patent JP2003336032
Kind Code:
A
Abstract:
To provide a heat-resistant adhesive suitable for manufacturing a coil requiring a high-level heat resistance.
An alkoxysilane compound in an amount of 5-50 pts.wt. is incorporated with 100 pts.wt. of a base adhesive comprising a polyimide, a polyamide or an epoxy adhesive.
Inventors:
UEHARA MASATAKE
Application Number:
JP2002142807A
Publication Date:
November 28, 2003
Filing Date:
May 17, 2002
Export Citation:
Assignee:
TOTOKU ELECTRIC
International Classes:
C09J179/08; C09J163/00; C09J177/00; C09J183/00; (IPC1-7): C09J179/08; C09J163/00; C09J177/00; C09J183/00