Title:
HEAT-RESISTANT AROMATIC POLYAMIDE AND COMPOSITION
Document Type and Number:
Japanese Patent JPH04130116
Kind Code:
A
Abstract:
PURPOSE:To obtain an aromatic polyamide improved in moldability, high- temperature mechanical strengths and chemical stability by polymerizing a specified aromatic polyamide oligomer. CONSTITUTION:An aromatic polyamide prepared by polymerizing an aromatic polyamide oligomer of formula I or II (wherein R1 and R2 are each a bivalent aromatic group; A and B are each an aliphatic or aromatic polymerizable unsaturated group, provided that at least either of A and B is a polymerizable unsaturated group comprising a polyamine/cyclic unsaturated acid anhydride adduct; E and F are each an aliphatic or aromatic polymerizable unsaturated group, provided that at least either of E and F is an unsaturated group comprising a polyamine/unsaturated acid chloride condensate; and (n) is 0-15). A thermosetting aromatic polyamide oligomer composition is obtained by mixing the above oligomer with at most 5wt.% radical polymerization initiator.
Inventors:
HOSOGANE TADAYUKI
NAKAJIMA HIROSHI
TAKIYAMA EIICHIRO
TOMIMATSU ICHITA
NAKAJIMA HIROSHI
TAKIYAMA EIICHIRO
TOMIMATSU ICHITA
Application Number:
JP25013190A
Publication Date:
May 01, 1992
Filing Date:
September 21, 1990
Export Citation:
Assignee:
SHOWA HIGHPOLYMER
International Classes:
C08G69/48; C08F290/00; C08F299/02; C08K5/14; C08L77/00; (IPC1-7): C08F299/02; C08G69/48; C08K5/14; C08L77/00
Attorney, Agent or Firm:
Yaguchi flat