PURPOSE: To manufacture a heat-resistant molded article having high dimensional accuracy and large surface area at low treating temperature, using a molding compound composed of an aromatic polyamide-imide and a specific inorganic insulating material.
CONSTITUTION: A molding mixture composed of (A) 100 parts by weight of powder of one or more inorganic insulating material selected from the oxides, nitrides and carbides of metals, B and Si, and (B) 1W10,000 parts of an aromatic polyamide-imide of formulas IWIII [Ar is difunctional residue of formulas IVWVII (R is H, halogen, alkyl; X is O, S, sulfonyl, carbonyl, carboxyl, methylene, dimethylmethylene); Ar' is a difunctional residue of formulas VIIIWX; n is a positive integer) having a reduced viscosity of 0.2W1.5, is dissolved in (C) 10W500 parts, based on 100 parts of (B), of a solvent of (B), e.g. dimethylformamide, cresol, etc. The solution containing uniformly dispersed (A) component, is cast to a desired shape, and the solvent is removed from the molded article.
KIMURA TAKEO
SHIBAZAKI ICHIROU
| JPS54143642A | 1979-11-09 | |||
| JPS494544A | 1974-01-16 |