Title:
HEAT-RESISTANT POLYAMIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH03273057
Kind Code:
A
Abstract:
PURPOSE:To improve color tone, moldability, and mold releasability without degrading mechanical properties by compounding a polyamide with a polyethylene glycol having an alkyl ether group at the molecular end and a copper halide. CONSTITUTION:100 pts.wt. polyamide pref. comprising nylon 6 or nylon 66 is compounded with 0.01-10 pts.wt. polyethylene glycol having alkyl ether group at the molecular end and shown by formula I (wherein R is a 1-4C linear or branched alkyl group; and (n) is 1-200, pref. 2-60), 0.01-0.1 pts.wt. copper halide of formula II (wherein X is a stable halogenation product of a monovalent copper) and, if necessary, a dye, a pigment, a thermal stabilizer, a UV absorber, a mold release agent, a filler, etc., to give the title compsn.
Inventors:
MATSUOKA YASUHIRO
AKAGAWA YOSHIFUMI
AKAGAWA YOSHIFUMI
Application Number:
JP7188590A
Publication Date:
December 04, 1991
Filing Date:
March 23, 1990
Export Citation:
Assignee:
UBE INDUSTRIES
International Classes:
C08K3/10; C08K3/16; C08L71/02; C08L77/00; (IPC1-7): C08K3/10; C08K3/16; C08L71/02; C08L77/00