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Patent Searching and Data


Title:
HEAT-RESISTANT RESIN COMPOSITION AND MOLDED PRODUCT
Document Type and Number:
Japanese Patent JPH10195302
Kind Code:
A
Abstract:

To obtain a composition which can give a molded product excellent in heat resistance, water repellency and oil repellency by mixing a thermoplastic heat-resistant resin having a specified or higher molding temperature with a polymer obtained by polymerizing a component consisting essentially of fluoroalkyl α-fluoroacrylate.

This composition comprises a thermoplastic heat-resistant resin having a molding temperature of 300°C or above (e.g. polyphenylene sulfide) and a polymer obtained by polymerizing a component consisting essentially of fluoroalkyl α-fluoroacrylate represented by formula I [wherein Rf is X- RF-(CH2)n- or a group of formula II; n is 0 or 1; X is H, F or CH3; RF is a 1-20C perfluoroalkylene, provided that it is -C(CF3)2- when n=0; Z is F or CF3; R'F is a 1-3C perfluoroalkyl; a to e are each 0 or 1 or greater; the sum of a to e is 1 or greater; and the order of bonding of the respective types of repeating units in parentheses with subscripts a to e is not limited]. This composition can give a molded product which has persistent water/oil repellency owing to the surface segregation of the polymer.


Inventors:
TANAKA YOSHITO
SHIMIZU TETSUO
Application Number:
JP446097A
Publication Date:
July 28, 1998
Filing Date:
January 14, 1997
Export Citation:
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Assignee:
DAIKIN IND LTD
International Classes:
C08L101/00; (IPC1-7): C08L101/00
Attorney, Agent or Firm:
Aoyama Ryo (1 person outside)