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Patent Searching and Data


Title:
HEAT-RESISTANT RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS5638319
Kind Code:
A
Abstract:

PURPOSE: The titled composition, capable of being easily impregnated and cast, having improved heat resistance and mechanical properties, and comprising an epoxy resin containing an imide ring, an acid anhydride and a polyfunctional maleimide compound.

CONSTITUTION: A composition comprising (A) an epoxy resin containing an imide ring obtained by reacting (a) an imidodicarboxylic acid having at least one imide ring in the molecule, e.g. formula I (R1 is bifunctional organic group) with (b) a polyfunctional epoxy compound, e.g. bisphenol A epoxy resin, (B) an acid anhydride as an epoxy resin curing agent and (C) a polyfunctional maleimide compound, e.g. formula II (R2 is H or CH3). The amount of the component (C) is 80W5pts.wt. per 20W95pts.wt. the mixture of the components (A) with (B). 0.5W20pts.wt. a phenoxy resin is further incorporated with 100pts.wt. the composition if necessary.


Inventors:
ETOU SHIYOUHEI
FUKAMI AKIRA
MORIWAKI NORIMOTO
NAKASHIMA HIROYUKI
Application Number:
JP11481079A
Publication Date:
April 13, 1981
Filing Date:
September 06, 1979
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
C08G59/00; C08G59/14; C08G59/16; C08G59/40; C08J5/24; C08L63/00; (IPC1-7): C08G59/14; C08G59/40; C08J5/24
Domestic Patent References:
JPS5180399A1976-07-13
JPS5180397A1976-07-13
JPS5019889A1975-03-03