Title:
HEAT-RESISTANT RESIN FOAM PLATE MATERIAL
Document Type and Number:
Japanese Patent JP2022073795
Kind Code:
A
Abstract:
To provide a heat-resistant resin foam plate material that improves fire retardancy and heat resistance of a phenolic resin foam plate material.SOLUTION: A heat-resistant resin foam plate material P includes surface materials L of a metal thin plate respectively stuck to both surfaces thereof. A resin foam F is formed by a porous thermoset resin with continuous cavities, and air bubble of a surface layer part thereof are loaded by a water-soluble inorganic modifier M containing at least silicon, sodium and boron.SELECTED DRAWING: Figure 2
Inventors:
TANAKA NARIMASA
INOYA HIROYUKI
INOYA HIROYUKI
Application Number:
JP2020183994A
Publication Date:
May 17, 2022
Filing Date:
November 02, 2020
Export Citation:
Assignee:
EIWA MATEKKUSU KK
International Classes:
B32B15/08; B29C39/10; B29C39/24; B29C44/00; B29C44/12; B29C44/36; B32B5/18; B32B9/00; E04C2/292
Attorney, Agent or Firm:
Hiroyuki Nakai