HEAT-RESISTANT RESIN, METHOD FOR PRODUCING THE SAME, AND DUST REMOVING SUBSTRATE OF SUBSTRATE PROCESSING APPARATUS GIVEN BY USING THE RESIN

Japanese Patent JP2006096864

A

To provide a heat-resistant resin capable of being used in an HDD application and in a part of semiconductor applications, even under such a situation that serious troubles may be caused by contamination with a silicone, especially, capable of being used for dust removal, to provide a method for producing the same, and to provide a dust removing substrate given by using the heat-resistant resin and used for conducting the dust removal of a substrate processing apparatus.

This heat-resistant resin is obtained by reacting a tetracarboxylic acid anhydride with a diamine compound, wherein the diamine compound contains an aliphatic primary diamine compound in an amount of ≥0.5 mol based on 1.0 mol of the tetracarboxylic acid anhydride and a polybutadiene structure in an amount of ≤0.5 mol. The method for producing the same and the dust removing substrate given by using the heat-resistant resin are provided, respectively.

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FUJII HIROFUMI
UENDA DAISUKE
MARUOKA NOBUAKI

JP2004284436A

April 13, 2006

September 29, 2004

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NITTO DENKO CORP

C08G73/10

Shohei Oguri
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu
Yuriko Hamada

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