To obtain a heat-resistant resin varnish that improves wettability to various substrates by its use as an additive to various coating agents, has no reduction in compatibility with a coating agent and no reduction in heat resistance, does not cause sink mark, cissing and pinhole after coating or during drying and curing, coats a fixed part in high precision and plays a role of leveling agent, a heat-resistant coating agent containing the heat-resistant resin varnish and an insulating film using the heat-resistant coating agent and to provide a semiconductor apparatus.

The heat-resistant resin varnish comprises a resin having a siloxane backbone. The heat-resistant coating agent comprises the heat-resistant resin varnish. The insulating film uses the heat-resistant coating agent. The semiconductor apparatus uses a protective coat.

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