Title:
ヒートシール性樹脂組成物
Document Type and Number:
Japanese Patent JP6451281
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a heat-sealing resin composition which is excellent in both heat seal strength and blocking resistance and exhibits good heat seal strength even when a heat seal temperature is low.SOLUTION: The heat-sealing resin composition contains an ethylene-vinyl acetate copolymer (resin A), a styrene-butadiene-styrene copolymer (resin B), a petroleum resin (resin C), and an organic solvent. The petroleum resin (resin C) is a petroleum resin having an acid value of 15-30 mg KOH/g.SELECTED DRAWING: None
Inventors:
Takeaki Matsuura
Tomohiro Noda
Tomohiro Noda
Application Number:
JP2014251592A
Publication Date:
January 16, 2019
Filing Date:
December 12, 2014
Export Citation:
Assignee:
Toyo Ink sc Holdings Co., Ltd.
Toyo Ink Co., Ltd.
Toyo Ink Co., Ltd.
International Classes:
C08L31/04; C08J7/04; C08L23/28; C08L53/02; C08L57/02; C09J123/08; C09J123/28; C09J131/04; C09J153/02; C09J157/02; C09K3/10
Domestic Patent References:
| JP2013213110A | ||||
| JP2004291311A | ||||
| JP2000290609A | ||||
| JP2005015597A | ||||
| JP6033027A | ||||
| JP2002067518A | ||||
| JP2009114440A |
Foreign References:
| US6414073 |