Title:
HEAT SENSITIVE STENCIL MASTER
Document Type and Number:
Japanese Patent JP2001171252
Kind Code:
A
Abstract:
To provide a heat sensitive stencil master, provided with a firm stiffness, large in adhesion with a film, capable of obtaining a printed image excellent in picture quality, and at the same time, few in offset bleeding.
This heat sensitive stencil master is produced by tightly contacting a thin film including the resin component of a porous resin film onto a thermoplastic resin film, on the surface of which the porous resin film is provided, on the surface of the side having the porous resin film thereon.
Inventors:
NATORI YUJI
ARAI FUMIAKI
TOSHIMOTO MASANORI
TANAKA TETSUO
TATEISHI HIROSHI
ARAI FUMIAKI
TOSHIMOTO MASANORI
TANAKA TETSUO
TATEISHI HIROSHI
Application Number:
JP2000308892A
Publication Date:
June 26, 2001
Filing Date:
October 10, 2000
Export Citation:
Assignee:
RICOH KK
TOHOKU RIKO KK
TOHOKU RIKO KK
International Classes:
B41C1/055; B32B5/18; B41N1/24; (IPC1-7): B41N1/24; B32B5/18; B41C1/055
Attorney, Agent or Firm:
Toshiaki Ikeura