To provide a heat-settable resin capable of producing a complicated composite structure by heat setting under ambient pressure without utilizing an autoclave.
The curable solid resin made by the process comprising steps providing a heat-settable mixture comprising a resin component, a curing agent component and a particulate component, said heat-settable mixture having a curing temperature such that said heat-settable mixture forms a cured resin when heated and wherein said particulate component comprises particles of a rigid-rod polymer that has a dissolution temperature where said rigid-rod polymer particles dissolve in said resin component, said heat-settable resin mixture is heated to a temperature that is equal to or above the dissolution temperature of said rigid-rod polymer and below said curing temperature of the heat-settable mixture, a step cooling said heat-set mixture to a temperature below the dissolution temperature of said rigid-rod polymer to form said curable solid resin.
| JPH0267333A | 1990-03-07 | |||
| JPH0776658A | 1995-03-20 |
| WO2002068555A1 | 2002-09-06 |
Hajime Asamura
Katsunori Ando
Yukihiro Ikeda
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