Title:
遮熱アセンブリ、及び遮熱アセンブリの航空機への取り付け
Document Type and Number:
Japanese Patent JP7300862
Kind Code:
B2
Abstract:
Various techniques provide a heat shield assembly and mounting thereof on an aircraft. In one example, a heat shield assembly may include flexible member. The heat shield assembly may further include a plurality of frame members disposed on the flexible member. The heat shield assembly may further include a plurality of mounting structures configured to directly mount the heat shield assembly to a strut of an airplane. Each of the plurality of mounting structures may be disposed on one of the plurality of frame members. Related methods are also provided.
Inventors:
Campbell, Lowell Bee.
Jones, Michael Dee.
Stefanovic, Milan
Jones, Michael Dee.
Stefanovic, Milan
Application Number:
JP2019056477A
Publication Date:
June 30, 2023
Filing Date:
March 25, 2019
Export Citation:
Assignee:
The Boeing Company
International Classes:
B64D33/00; B64C1/00; B64C1/40; B64D29/02
Domestic Patent References:
| JP62041490A | ||||
| JP2017206230A |
Foreign References:
| US20150144732 | ||||
| US20130032662 | ||||
| FR2983172A1 | ||||
| US4717094 | ||||
| US20090095443 | ||||
| US20180057140 |
Attorney, Agent or Firm:
Sonoda & Kobayashi Patent Attorneys Corporation