Title:
ボンドコートバリアを有する遮熱システム
Document Type and Number:
Japanese Patent JP6788035
Kind Code:
B2
Abstract:
A coating system disposed on a surface of a substrate is provided. The coating system includes a bond coating on the surface of the substrate, a protective coating on the bond coating, a thermal barrier coating on the protective coating, and a protective agent disposed within at least some of the voids of the thermal barrier coating. The protective coating is constructed from a ceramic material, and the thermal barrier coating defines a plurality of elongated surface-connected voids. Methods are also generally provided for forming such a coating system.
Inventors:
Chapman, Julie Marie
Eckhart, Robert
Das, Nuripendola eggplant
Eckhart, Robert
Das, Nuripendola eggplant
Application Number:
JP2018558402A
Publication Date:
November 18, 2020
Filing Date:
May 09, 2017
Export Citation:
Assignee:
GENERAL ELECTRIC COMPANY
International Classes:
C23C26/00
Domestic Patent References:
| JP2002536543A | ||||
| JP2016113360A | ||||
| JP2015501375A |
Foreign References:
| US20030207079 | ||||
| US20090017260 | ||||
| US20050129869 | ||||
| US20090252985 | ||||
| US20160115818 | ||||
| US20160115819 | ||||
| EP3031954A1 |
Attorney, Agent or Firm:
Masato Iida
Choi
Kenji Tanaka
Arakawa Satoshi
Hirokazu Ogura
Takuto Tanaka
Choi
Kenji Tanaka
Arakawa Satoshi
Hirokazu Ogura
Takuto Tanaka