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Title:
HEAT SHRINK DEVICE AND ENCAPSULATION PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2012228056
Kind Code:
A
Abstract:

To provide a heat shrink device capable of suppressing generation of air bubbles or the size thereof in a heat shrink member after heat shrinkage and an encapsulation processing method.

A shrink device 2 heats a cylindrical heat shrinkage tube 14 arranged so as to accommodate a predetermined range including a protrusion 111 of a coupling member 11 for coupling a cable 10 and a harness 12, in such a manner that heat shrinkage in a first heated area 14a of the heat shrinkage tube 14 corresponding to the outer peripheral side of the protrusion 111 begins prior to heat shrinkage in a second heated area 14b including an end of the heat shrinkage tube 14 spaced from the first heated area 14a; and encapsulates the predetermined range of the cable 10, the harness 12, and the coupling member 11 by the heat shrinkage tube 14.


Inventors:
WARAYA KIMITOSHI
Application Number:
JP2011093109A
Publication Date:
November 15, 2012
Filing Date:
April 19, 2011
Export Citation:
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Assignee:
HITACHI CABLE
International Classes:
H02G1/14
Domestic Patent References:
JPS5649081U1981-05-01
JP2007220681A2007-08-30
JPH11207823A1999-08-03
Attorney, Agent or Firm:
Tadao Hirata
Kenji Tsunoda
Yuji Iwanaga
Keiko Nakamura
Endo Wako
Takashi Nomiyama