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Title:
HEAT SINK DEVICE
Document Type and Number:
Japanese Patent JP2001102508
Kind Code:
A
Abstract:

To provide a heat sink device, where the flow speed distribution of coolant is almost constant in the direction vertical to a heat sink base surface.

This device relates to improvement in the cooling performance of a heat sink device, and as a means of expanding the width of an air path formed between adjacent fins of the heat sink as the distance from a heat sink base in vertical direction increases, the thickness of a heat sink fin decreases as the distance from the heat sink base in vertical direction increases. Thus, the air current deviated to the fin base plane vicinity moves to above the fin for even wind speed distribution between fins. So the heat-transfer area is effectively assured over the entire height direction of the fin, resulting in a substantial improvement in cooling performance, while the cooling performance for the same volume is improved significantly. A detour air path in assured with respect to closure of air path due to deposition of dust, etc., for less performance degradation.


Inventors:
KAGA KUNIHIKO
CHIBA HIROSHI
KASHIBA YOSHIHIRO
Application Number:
JP28109899A
Publication Date:
April 13, 2001
Filing Date:
October 01, 1999
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H05K7/20; H01L23/36; H01L23/467; (IPC1-7): H01L23/467; H05K7/20
Attorney, Agent or Firm:
Kaneo Miyata (2 outside)



 
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