Title:
HEAT SINK
Document Type and Number:
Japanese Patent JP3960192
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a heat sink where warpage can be reduced irrespective of a difference in a coefficient of thermal expansion with a body to heat sink and a drop of thermal conductivity can be suppressed.
SOLUTION: In a low thermal expansion material 18, steps 20 are arranged in a region confronted with an insulating substrate 11 in a thickness direction. When the coefficient of thermal expansion on an insulating substrate 11 is larger than that on the heat sink 16, a corresponding region of the low thermal expansion material 18 with the insulating substrate 11 is formed to dent so that it recedes from the insulating substrate 11 in the heat sink 16. When the coefficient of thermal expansion on the heat sink 16 is larger than that on the insulating substrate 11, the corresponding position of the low thermal expansion material 18 with the insulating substrate 11 is formed to swell so that it approaches the insulating substrate 11.
Inventors:
Nagatomo Yoshiyuki
Ken Negishi
Toshiyuki Nagase
Ken Negishi
Toshiyuki Nagase
Application Number:
JP2002303002A
Publication Date:
August 15, 2007
Filing Date:
October 17, 2002
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
H01L23/36; (IPC1-7): H01L23/36
Domestic Patent References:
| JP62252657A | ||||
| JP5109947A | ||||
| JP6339634A | ||||
| JP9262657A | ||||
| JP10150124A | ||||
| JP2002043480A |
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Masakazu Aoyama
Akihiko Eguchi
Hideyuki Sugiura
Yasuhiko Murayama
Noriko Yanai
Tadashi Takahashi
Masakazu Aoyama
Akihiko Eguchi
Hideyuki Sugiura
Yasuhiko Murayama
Noriko Yanai