Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HEAT STABILIZER AND THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH0665321
Kind Code:
A
Abstract:

PURPOSE: To obtain a heat stabilizer which gives a thermoplastic resin compsn. excellent in heat resistance, delamination resistance, and flowability by copolymerizing an epoxidized vinyl compd. with another copolymerizable vinyl compd.

CONSTITUTION: A heat stabilizer is prepd. by copolymerizing 0.01-50wt.% epoxidized vinyl compd. of formula I (wherein Ar is a 9-23C arom. hydrocarbon group having at least one group selected from glycidyloxy and glycidyl groups; and R is H or CH3)(e.g. a compd. of formula II) with 50-99.99wt.% other copolymerizable vinyl compd. (e.g. one contg. at least 20% α-methylstyrene and/or β-isopropylnaphthalene). The stabilizer is compounded into an olefin resin to give a thermoplastic resin compsn. excellent in heat resistance, delamination resistance, and flowability.


Inventors:
WADA KAZUHITO
MISHIMA YASUHIRO
Application Number:
JP22045892A
Publication Date:
March 08, 1994
Filing Date:
August 19, 1992
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KANEGAFUCHI CHEMICAL IND
International Classes:
C08F212/08; C08F212/00; C08L23/00; C08L25/08; C08L33/04; C08L33/14; C08L33/24; C08L35/00; C08L57/00; (IPC1-7): C08F212/08; C08L23/00; C08L25/08; C08L33/14; C08L35/00
Attorney, Agent or Firm:
Sota Asahina (1 person outside)