Title:
THERMAL STORAGE PACK AND THERMAL STORAGE FLOOR STRUCTURE USING THE SAME
Document Type and Number:
Japanese Patent JP2021181870
Kind Code:
A
Abstract:
To provide a thermal storage pack that improves thermal conduction of a latent heat storage agent filled into a pouch with a simple structure.SOLUTION: A thermal storage pack 10 includes: a bag-shaped pouch 11 with an injection port from which a latent heat storage agent is injected; and a thermal conduction sheet 14 stored in the bag-shaped pouch 11 while being folded into a pantograph shape and widened while inflating the bag-shaped pouch 11 by filling a latent heat storage agent. The thermal storage pack 10 further includes a sheet material 15 for holding the bag-shaped pouch by bonding at least part of a rear face 11b of the bag-shaped pouch 11 thereto.SELECTED DRAWING: Figure 2
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Inventors:
YOSHIDA SHOTARO
SHODA TAKAHIRO
SHODA TAKAHIRO
Application Number:
JP2020088285A
Publication Date:
November 25, 2021
Filing Date:
May 20, 2020
Export Citation:
Assignee:
YAZAKI CORP
International Classes:
F28D20/02; E04F15/18; F24D11/00
Attorney, Agent or Firm:
Hidekazu Miyoshi
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu
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