To provide a heat storage resin composition having high moldability and selectivity of resin and keeping high heat storage performance after repeated utilization.

The heat storage resin composition comprises a microcapsule including a heat storage material in a resin. The heat storage material included in the microcapsule is used in order to store heat by utilizing latent heat. The film of the microcapsule is a thermosetting urea-formalin resin or melamine-formalin resin film and has ≤10 μm volume average particle diameter.