Title:
HEAT TRANSFER DEVICE AND METHOD FOR MANUFACTURING HEAT TRANSFER DEVICE
Document Type and Number:
Japanese Patent JP2020041726
Kind Code:
A
Abstract:
To provide a heat transfer device that can be readily improved in heat transfer performance, and to provide a method for manufacturing the same.SOLUTION: A heat transfer device includes: a tube 20 serving as a heat transfer member having thermal conductivity; and a fin 21 joined to the tube 20 and transmitting heat between the fin and the tube 20. The fin 21 is a bonding wire member. Thus, the bonding wire member with excellent thermal conductivity is joined to the heat transfer member as the fin 21 of the heat transfer device.SELECTED DRAWING: Figure 3
Inventors:
NAKAMURA KOHEI
Application Number:
JP2018168218A
Publication Date:
March 19, 2020
Filing Date:
September 07, 2018
Export Citation:
Assignee:
DENSO CORP
International Classes:
F28F1/12; B23K1/00; F28F1/32; F28F1/36; F28F21/02; F28F21/08
Attorney, Agent or Firm:
Kazuyuki Yahagi
Taihei Nonobe
Takanori Kubo
Taihei Nonobe
Takanori Kubo