Title:
HEAT TRANSFER METHOD AND DEVICE
Document Type and Number:
Japanese Patent JP2004146819
Kind Code:
A
Abstract:
To provide a cooling method for an electronic assembly such as a semiconductor chip by using a thin layer of a liquid metal with a high conductivity.
The liquid metal 18 is preferably gallium, or its alloy, that conducts heat from a chip 14 to a heat sink or a heat dissipation section 16. This system has more than one aperture part 38 that allows the filling of a liquid and evacuation of a space occupied by the liquid. The system also uses a flexible seal like a film held to a proper place by an O ring or a retaining ring, or a plug that seals the filling aperture part. The seal is flexible so that it deals with the expansion and contraction of the liquid as well as a phase change from a liquid phase to a solid phase.
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Inventors:
CALMIDI VARAPRASAD V
JOHNSON ERIC A
STUTZMAN RANDALL J
JOHNSON ERIC A
STUTZMAN RANDALL J
Application Number:
JP2003343853A
Publication Date:
May 20, 2004
Filing Date:
October 01, 2003
Export Citation:
Assignee:
IBM
International Classes:
H01L23/16; H01L23/34; H01L23/36; H01L23/42; H01L23/473; H01L21/56; (IPC1-7): H01L23/34; H01L23/36
Attorney, Agent or Firm:
Hiroshi Sakaguchi
Yoshihiro City
Takeshi Ueno
Yoshihiro City
Takeshi Ueno
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