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Title:
HEAT-TRANSFER METHOD TO SYNTHETIC RESIN PLATE
Document Type and Number:
Japanese Patent JP2001335015
Kind Code:
A
Abstract:

To prevent deformation due to a difference in temperatures between a surface and a rear face when a thermoplastic synthetic resin plate is cooled in a decorating process of the thermoplastic synthetic resin plate by heat-transfer paper.

Heat-transfer is performed by mounting the heat-transfer paper 1 on a surface of the thermoplastic resin plate 4 and hot-pressing. The plate is cooled with the heat-transfer paper 1 attached after hot-pressing, so that the entire plate is uniformly cooled by allowing more heat of the plate 4 to escape from a rear face side. Thereafter the heat-transfer paper 1 is peeled off thereby preventing deformation due to cooling of the thermoplastic synthetic resin plate 4. Thus a large difference in thermal expansion and contraction does not occur between the surface and the rear face, resulting in no deformation such as a warp. Therefore, it is not necessary to correct the deformation such as the warp by preheating in subsequent vacuum forming or the like, thereby attaining improved productivity.


Inventors:
SUGIOKA YOSHIHIKO
HOKAO SHIGEAKI
GONDO KEIJI
Application Number:
JP2000155650A
Publication Date:
December 04, 2001
Filing Date:
May 26, 2000
Export Citation:
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Assignee:
INAX CORP
International Classes:
B41F16/00; B44C1/17; B65C1/02; B65C9/38; (IPC1-7): B65C9/38; B41F16/00; B44C1/17; B65C1/02
Attorney, Agent or Firm:
Toshihiko Uchida