Title:
HEAT TRANSFER PREPREG AND METHOD FOR PRODUCING THE SAME AND HEAT TRANSFER PRINTED CIRCUIT BOARD USING THE SAME
Document Type and Number:
Japanese Patent JP2009019152
Kind Code:
A
Abstract:
To solve the problems of a conventional printed circuit board wherein the flexibility deterioration such as bending cracking is caused, when the heat transfer property thereof is enhanced, and whose heat conductivity enhancement is difficult, when the flexibility is enhanced.
This prepreg used for producing a heat transfer printed circuit board 26 which is hardly cracked, even when the heat conductivity is enhanced, is produced by coating glass fibers 12 with a necessary minimum amount of a semi-cured resin 13 and then forming a composite material 14 excellent in a heat transfer property on the surfaces of the coated glass fibers.
Inventors:
ASAHI TOSHIYUKI
KITAGAWA SHOYO
ECHIGO FUMIO
KATSUMATA MASAAKI
KITAGAWA SHOYO
ECHIGO FUMIO
KATSUMATA MASAAKI
Application Number:
JP2007183977A
Publication Date:
January 29, 2009
Filing Date:
July 13, 2007
Export Citation:
Assignee:
PANASONIC CORP
International Classes:
C08J5/24; H05K1/03; H05K3/46
Attorney, Agent or Firm:
Fumio Iwahashi
Hiroki Naito
Daisuke Nagano
Hiroki Naito
Daisuke Nagano