HEAT TRANSFER SUBSTRATE - PANASONIC CORP

Title:

HEAT TRANSFER SUBSTRATE

Document Type and Number:

Japanese Patent JP2014135374

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide a heat transfer substrate which prevents the deterioration of reliability and degradation that result from the deterioration of a joint part even if a heating element generating a large amount of heat is applied.SOLUTION: A heat transfer substrate includes: a metal plate 7; an insulation resin layer 8 laminated on an upper surface of the metal plate 7; and a heating element mounting substrate 9 which is embedded at the upper surface side of the insulation resin layer 8 and exposed only on an upper surface. A protruding part 11 which protrudes toward the heating element mounting substrate 9 side and has a plane part on a top surface is provided at a portion of the metal plate 7 which faces the heating element mounting substrate 9. The top surface is placed in contact with a bottom surface of the heating element mounting substrate 9.

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JPS58170044	SEMICONDUCTOR ELEMENT
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Inventors:

SHIMOYAMA KOJI
TSUMURA TETSUYA
ENDO KENJI

Application Number:

JP2013002279A

Publication Date:

July 24, 2014

Filing Date:

January 10, 2013

Export Citation:

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Assignee:

PANASONIC CORP

International Classes:

H01L23/36; H01L23/12; H01L23/467; H01L33/64

Attorney, Agent or Firm:

Hiroki Naito
Kentaro Fujii
Ikuro Terauchi

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