Title:
HEAT-TREATING DEVICE
Document Type and Number:
Japanese Patent JP3715073
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a heat-treating device which can effectively prevent the positional deviation of a substrate, when the substrate is elevated and lowered while the substrate is supported by supporting pins.
SOLUTION: A heat-treating device is provided with a heat-treating section 2 having a heating plate 12 and a cooling section 3 having a cooling plate 22 in a housing 4. Each of the heating and the cooling plates 12, 22 has three through holes 13, and three supporting pins 14 are provided so that the pins 14 may be elevated and lowered through the holes 13. The pins 14 are erected on a supporting arm 15 coupled with an air cylinder 16 at the positions oppositely faced to the peripheral edge of the backside of a substrate W supported on the pins 14.
Inventors:
Takanori Kawamoto
Masami Otani
Yasuo Imanishi
Masao Tsuji
Yuki Iwami
Akihiko Morita
Yoichi Nishimura
Masami Otani
Yasuo Imanishi
Masao Tsuji
Yuki Iwami
Akihiko Morita
Yoichi Nishimura
Application Number:
JP12017497A
Publication Date:
November 09, 2005
Filing Date:
April 22, 1997
Export Citation:
Assignee:
Dainippon Screen Mfg. Co., Ltd.
International Classes:
H01L21/683; F27D5/00; H01L21/027; H01L21/68; (IPC1-7): H01L21/027; H01L21/68
Domestic Patent References:
| JP8124818A | ||||
| JP3035011A | ||||
| JP8222503A | ||||
| JP5047652A | ||||
| JP4181717A | ||||
| JP5304071A |
Attorney, Agent or Firm:
Takashi Otsubo
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