PURPOSE: To obtain a countermeasure for excessive baking with a simple constitution and to omit a buffer device, by separating a body under heat treatment from a heater and a cover after heat treatment of the body under heat treatment is finished, supporting the body with rod shaped bodies, and making it possible to support the body for a specified time.
CONSTITUTION: After heat treatment is finished, a cover 17 and pins 16 are fixed. A hot plate 13 is lowered with a lift mechanism 14. At this time, a semiconductor wafer 12 is mounted on the tip parts of the pins 16 that are positioned in a protruding mode higher than the mounting surface of the hot plate 13. The wafer 12 is lifted from the hot plate 13. Since the cover 17 and the hot plate 13 are separated, a gap 20 is formed. Therefore, the semiconductor wafer 12 is cooled. Namely, even if the semiconductor wafer 12 after the heat treatment cannot be carried out, countermeasure for excessive baking can be performed and the function of a buffer can be performed under the state wherein the semiconductor wafer 12 can be kept in the chamber 11 for a specified time.
HIRAKAWA OSAMU
AKUMOTO MASAMI
USHIJIMA MITSURU
TOKYO ELECTRON LTD
| JPS6331118A | 1988-02-09 |