Title:
加熱処理装置および加熱処理方法
Document Type and Number:
Japanese Patent JP7246446
Kind Code:
B2
Abstract:
To provide a heat treatment device capable of reducing maintenance due to a solid body adhered to an inner wall of a chamber.SOLUTION: A heat treatment device is equipped with a chamber that can maintain an atmosphere of reduced pressure lower than the atmospheric pressure, an exhaust portion that exhausts the inside of the chamber through an exhaust port provided in the chamber, a supporting portion that is provided in the chamber and can support work, a first heating portion that is provided in the chamber and can heat the work, a deposition preventive plate that is detachably provided on an inner wall of the chamber, and a second heating portion that can heat the deposition preventive plate.SELECTED DRAWING: Figure 1
Inventors:
Yuichi Imaoka
Yosuke Mochizuki
Kuroiwa Kyota
Akinori Iso
Yosuke Mochizuki
Kuroiwa Kyota
Akinori Iso
Application Number:
JP2021154575A
Publication Date:
March 27, 2023
Filing Date:
September 22, 2021
Export Citation:
Assignee:
Shibaura Mechatronics Co., Ltd.
International Classes:
F27B5/04; F27B5/14; F27B5/16; F27D7/00; F27D9/00; F27D11/02; H01L21/324
Domestic Patent References:
JP2018169050A | ||||
JP2015048974A | ||||
JP10141861A | ||||
JP9286668A | ||||
JP11337266A |
Attorney, Agent or Firm:
Hyuga Temple Masahiko
Junichi Kozaki
Hiroshi Ichikawa
Junichi Kozaki
Hiroshi Ichikawa
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