Title:
HEAT TREATMENT APPARATUS AND METHOD THEREFOR
Document Type and Number:
Japanese Patent JP3333135
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a rapid and uniform heat treatment apparatus and its method for treating by heat the whole substrate without causing electrostatic breakdown.
SOLUTION: A plurality of minute protecting pins 93 are provided on the upper face of a heat-treatment board 58, and through-holes 90 for carrying out evacuation are provided between these pins 93. A space between the lower face of a substrate (G) and an upper face of a heat treatment board 58 is subjected to negative pressure by sucking under negative pressure through the through-holes 90 for a given first-stage-treatment time, so that the substrate (G) is put in contact with the heat-treatment board 58. Then, the degree of vacuum is reduced to separate the substrate (G) from the heat-treatment board 58 through self-rigidity of the substrate (G). In the first-stage treatment step, since the substrate (G) and the heat treatment board 58 are brought into direct contact, the temperature is increased rapidly and uniformly. Since the substrate (G) and the heat treatment board 58 are separated while the heat contraction is large, abrasive electricity is hardly generated, and electrostatic breakdown can be prevented surely.
Inventors:
Tetsuya Sada
Application Number:
JP17911498A
Publication Date:
October 07, 2002
Filing Date:
June 25, 1998
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
G02F1/13; F27D5/00; H01L21/027; H01L21/30; H01L21/68; H01L21/683; (IPC1-7): H01L21/027; G02F1/13; H01L21/68
Domestic Patent References:
| JP942854A | ||||
| JP4196245A | ||||
| JP547652A | ||||
| JP677231U |
Attorney, Agent or Firm:
Saichi Suyama
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