HEAT TREATMENT APPARATUS AND METHOD

Title:

HEAT TREATMENT APPARATUS AND METHOD

Document Type and Number:

Japanese Patent JPH11214319

Kind Code:

A

Abstract:

To provide a small temperature distribution, by compensating an exponentially functioning change of radiant energy density of heating material in lamp heating.

A plurality of spherical lamps 1 are put facing a plate-shaped wafer 2. The plurality of lamps 1 are partitioned in almost concentric control zones, and the wafer 2 is heated, while the amount of irradiation by the lamp 1 is set. In this case, the irradiation by the spherical lamp 1 is so set that the difference of irradiation energy of each region corresponding to the control zone becomes larger the neaer the region is to the outer side. Then, an exponentially functioning change of the radiant energy density is compensated and a small temperature distribution on the wafer 2 in a radial direction is obtained.

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Inventors:

KIMURA MINORU
ITO MASAATSU
TAKEDA SHIGERU
HIROSE SHOJI

Application Number:

JP29399298A

Publication Date:

August 06, 1999

Filing Date:

October 15, 1998

Export Citation:

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Assignee:

NIPPON SOKEN

International Classes:

H05B3/10; F21S8/04; H01J5/50; H01K7/00; H01L21/20; H01L21/26; (IPC1-7): H01L21/26; H01K7/00; H05B3/10

Attorney, Agent or Firm:

Hirohiko Usui

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