Title:
HEAT TREATMENT APPARATUS FOR SEMICONDUCTOR WAFER
Document Type and Number:
Japanese Patent JP2002093733
Kind Code:
A
Abstract:
To provide a heat treatment apparatus of a semiconductor wafer, which can prevent air for cooling introduced into a space between a heater and a liner tube from leaking into load chamber.
A clearance between a tube support 5 and a flange 2c of a process tube 2 is sealed by an annular seal packing 16.
Inventors:
ITO MAKOTO
FUKUYAMA YOSHIHARU
FUKUYAMA YOSHIHARU
Application Number:
JP2000283633A
Publication Date:
March 29, 2002
Filing Date:
September 19, 2000
Export Citation:
Assignee:
KOYO THERMO SYS KK
International Classes:
F27B5/06; F27D7/06; H01L21/22; H01L21/31; (IPC1-7): H01L21/22; F27B5/06; F27D7/06; H01L21/31
Attorney, Agent or Firm:
Takafumi Watanabe