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Patent Searching and Data


Title:
HEAT TREATMENT APPARATUS AND HEAT TREATING METHOD
Document Type and Number:
Japanese Patent JP2002353211
Kind Code:
A
Abstract:

To provide a heat treatment apparatus which can surely prevent the condensation of a process gas in the position of the base end side of a gas introducing pipe and set up the gas introducing pipe with high positional accuracy and repeatability, and to provide a heat treating method.

In the heat treatment apparatus which performs heat treatment to objects W to be treated introducing a process gas through a gas introducing pipe 5 into a treating vessel 1 for housing the objects W, a holder 4 is arranged at the base end of the gas introducing pipe 5, and a high heat conducting member 29 is mounted on this holder 4. This heat conducting member 29 is arranged in the position transmitting heat energy for heating the inside of the treating vessel 1 and the heat conducting member 29 is comprised of SiC which is excellent in thermal conductivity.


Inventors:
YAMAMOTO HIROYUKI
USHIKUBO SHIGEHIRO
HASEBE KAZUHIDE
UMEHARA TAKAHITO
Application Number:
JP2001158477A
Publication Date:
December 06, 2002
Filing Date:
May 28, 2001
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
F27B5/16; F27D7/06; H01L21/22; H01L21/31; H01L21/324; (IPC1-7): H01L21/31; F27B5/16; F27D7/06; H01L21/22; H01L21/324
Attorney, Agent or Firm:
Tetsuo Kobayashi