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Title:
HEAT TREATMENT APPARATUS
Document Type and Number:
Japanese Patent JP2007134518
Kind Code:
A
Abstract:

To improve heat insulation, the yield of substrate processing, and quality without increasing the entire length of a heat insulator of a substrate holding tool for holding a substrate to be processed and without increasing the number of heat insulating sheets used in the heat insulation part in a heat treatment apparatus.

The heat treatment apparatus comprises a treatment chamber 22 for accommodating and treating a substrate; a heater for heating the treatment chamber; and a substrate holding tool 21 for holding a desired number of the substrates in the treatment chamber. The substrate holding tool includes a substrate holder for holding the substrate; and a heat insulator located below the substrate holder and including a desired number of heat insulation plates, with a pitch of the heat insulation plate located above the heat insulator made smaller than that of the heat insulation plate of a lower part of the same.


Inventors:
NAKAMURA IWAO
SASAJIMA RYOTA
Application Number:
JP2005326524A
Publication Date:
May 31, 2007
Filing Date:
November 10, 2005
Export Citation:
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Assignee:
HITACHI INT ELECTRIC INC
International Classes:
H01L21/31; H01L21/22; H01L21/324
Domestic Patent References:
JP2001291670A2001-10-19
JPH05218186A1993-08-27
JPH08316158A1996-11-29
JP2002025995A2002-01-25
Attorney, Agent or Firm:
Shoji Miyoshi