Title:
非均一断熱を有する熱処理デバイス
Document Type and Number:
Japanese Patent JP7058637
Kind Code:
B2
Abstract:
A thermal process device for heat treating a product or plurality of products includes a thermal processing chamber having opposed distal ends and at least one controllable heating zone. At least one buffer zone disposed is at each of the distal ends, the buffer zones and at least one heating zone of the thermal processing chamber forming a heating element assembly having an inner and outer surface. At least one layer of insulating material is disposed along the at least one buffer and heating zones of the thermal processing chamber and forming part of the heating element assembly, the at least one layer of insulating material having a controlled efficiency being applied non-uniformly across an axial length of the heating assembly.
Inventors:
Peck, Kevin
Application Number:
JP2019506187A
Publication Date:
April 22, 2022
Filing Date:
August 05, 2017
Export Citation:
Assignee:
Kantal Thermal Process, Ink.
International Classes:
F27D1/00; F27D9/00
Domestic Patent References:
| JP1192113A | ||||
| JP2003075070A | ||||
| JP5504227A | ||||
| JP50099963A |
Attorney, Agent or Firm:
Sonoda/Kobayashi Patent Business Corporation
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