Title:
HEAT TREATMENT DEVICE
Document Type and Number:
Japanese Patent JP3464005
Kind Code:
B2
Abstract:
PURPOSE: To provide a heat treatment device which can heat-treat the whole surface of a planar object to be treated quickly at uniform temperature by controlling the temperature of a planar heating source, separately for each of a plurality of coaxial circular band areas.
CONSTITUTION: This device is equipped with a planar heating source 2, which is arranged to face the treatment face of a planar object 1 to be treated and comprises a plurality of circular heating elements different in diameter arranged coaxially, a heating controller 25, which controls the heating of the plurality of circular heating elements independently, and a shifting mechanism 5, which brings the object 1 to be treated and the planar heating source 2 relatively close to each other.
Inventors:
Wataru Ohkase
Application Number:
JP22969591A
Publication Date:
November 05, 2003
Filing Date:
August 16, 1991
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/205; C23C16/46; C30B35/00; F27D11/02; H01L21/22; H01L21/285; H01L21/31; H01L21/324; (IPC1-7): H01L21/22; C23C16/46; C30B35/00; F27D11/02; H01L21/205; H01L21/285; H01L21/31; H01L21/324
Domestic Patent References:
| JP63232422A | ||||
| JP227715A | ||||
| JP5936927A | ||||
| JP63124739U |
Attorney, Agent or Firm:
Tadahiko Ito
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