Title:
熱処理方法および熱処理装置
Document Type and Number:
Japanese Patent JP7091227
Kind Code:
B2
Abstract:
Product recipes in which a treatment procedure and treatment conditions of heat treatment of product wafers are specified are created timely. Dummy recipes in which a treatment procedure and treatment conditions of heat treatment of dummy wafers are specified are also created. Each of the product recipes and a corresponding one of the dummy recipes are stored in association with each other. Dummy treatment of a dummy wafer starts when a controller receives an advance notice signal indicating that product wafers will arrive at a heat treatment apparatus. The dummy wafers are stored in a dummy carrier permanently installed on a load port exclusive to the dummy carrier. The dummy treatment is performed in accordance with a dummy recipe associated with a product recipe corresponding to the product wafers scheduled to arrive at the heat treatment apparatus.
Inventors:
Shinichi Ikeda
Application Number:
JP2018207869A
Publication Date:
June 27, 2022
Filing Date:
November 05, 2018
Export Citation:
Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/26; H01L21/02; H01L21/265
Domestic Patent References:
| JP2000232108A | ||||
| JP837158A | ||||
| JP1041239A | ||||
| JP2005150363A | ||||
| JP2018148178A |
Attorney, Agent or Firm:
Hidetoshi Yoshitake
Takahiro Arita
Takahiro Arita